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Manufacturer AMD NATIONAL SEMICONDUCTOR NXP ON SEMICONDUCTOR ST MICROELECTRONICS

Additional Feature FULL DUPLEX HALF DUPLEX; FULL DUPLEX

Data Rate 0.3 1.2 4.8

JESD-30 Code R-CDIP-T28 R-PDIP-T20 R-PDSO-G16 R-PDSO-G28 S-PQCC-J28 S-PQFP-G32 S-PQFP-G44

JESD-609 Code e0 e3 e4

Length 10 11.506 26.075 38.4302 7 9.7

Moisture Sensitivity Level 3

Neg Supply Voltage-Nom -5

Number of Functions 1

Number of Terminals 16 20 28 32 44

Operating Temperature-Max 70 85

Operating Temperature-Min 0 -40

Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY

Package Code DIP HTSSOP LQFP QCCJ SOP

Package Equivalence Code DIP20,.3 DIP28,.6 LDCC28,.5SQ QFP32,.35SQ,32 QFP44,.47SQ,32 SOP16,.4 TSSOP28,.25

Package Shape RECTANGULAR SQUARE

Package Style CHIP CARRIER FLATPACK, LOW PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (Cel) 245 260 NOT SPECIFIED

Power Supplies 3.3/5 5 -5 5,9

Seated Height-Max 1.2 1.6 4.572 5.08

Supply Current-Max 0.0006 0.068 0.16

Supply Voltage-Nom 3.3 5

Surface Mount NO YES

Technology BCDMOS CMOS MOS

Temperature Grade COMMERCIAL INDUSTRIAL

Terminal Finish Matte Tin (Sn) - annealed Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn) Tin/Lead (Sn/Pb)

Terminal Form GULL WING J BEND THROUGH-HOLE

Terminal Pitch .65 .8 0.8 1.27 2.54

Terminal Position DUAL QUAD

Time@Peak Reflow Temperature-Max (s) 30 40 NOT SPECIFIED

Width 10 11.506 15.24 4.4 7 7.62

Part Number	Description	In Stock
MM74HC943N Mfr: national semiconductor	0.3kbps DATA, MODEM, PDIP20	4
AM7911DI Mfr: advanced micro devices	1.2kbps DATA, MODEM, CDIP28	2
description1 Mfr: manufacturer	ext_desc	0

Semiconductors > Telecom ICs > Modems